Palomar Process Development Services

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This service may include package design, materials and plating specifications, solder alloy selection, upstream and downstream assembly line balancing, tooling design, thermal analysis and furnace profile development. The Palomar and SST Process Development Teams have special expertise in the areas of mechanical design, process maturation strategies, techniques and designs for optimal and scalable automation, high accuracy eutectic and epoxy die attach, complex wire bonding, metallurgy, failure analysis, thermodynamics and high vacuum technology—all relating directly to microelectronic package assembly.


Assembly Services_Expert Process Dev


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