SST 3150 High Vacuum Furnace

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The SST 3150 is designed to create high reliability MEMS packages. Packages are hermetically sealed with very low vacuum and moisture levels for extended, long term performance. The 3150 provides vacuum levels as low as 10-7 Torr, and temperatures up to 500°C (1000°C optional). The clean-room compatible system may also be configured to allow for in situ separation of lid and package, getter firing and sealing of MEMS packages. The 3150 utilizes a turbo-molecular drag pump for effective pumping of hydrogen gas molecules. An optional cryogenic water pump may be added to the system for processes requiring extremely low levels of residual water vapor.


  • MEMS Package Sealing
  • Infrared Sensor Package Sealing
  • Hermetic Package Sealing
  • Crystal Oscillator Package Sealing
  • Wafer Level Packaging
  • Void-Free Eutectic Die Attach
  • Low Moisture Package Sealing
  • Nobel Gas Miniature Lamp Sealing
  • Military Electronic Package Sealing


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