Wafer Die Ejection Systems

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A wide selection of integrated wafer die ejection solutions are available which leverage the abilities of Palomar die bonding systems to handle even the most difficult die. From large wafers to multiple wafers, high aspect ratio die to extremely small die, thin wafers to very large die, Palomar’s integrated solutions and customizable options ensure high throughput in every situation.

Alternate grip ring tooling 900x900


  • Optoelectronic packaging
  • Microwave modules 
  • RF packages 
  • VCSEL, PD, DFB Laser, Lens Attach 
  • RF GaN 5G power amplifiers 
  • RF power amplifier


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