6500 Die Bonder

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The Palomar 6500 Die Bonder offers a balanced combination of accuracy, speed, and flexibility in a compact system footprint. The 6500 Die Bonder performs ultra-high accuracy eutectic and adhesive placements with cycle times under seven seconds using its four-axis positioning system driven by linear motors gliding over air bearings on a steel based frame.


  • P-side down laser diode attachment 
  • Silicon bench (V-Groove) placement 
  • High-density RF power transistors 
  • Ultra-fine pitch hybrid assemblies 
  • MEMS components
  • VCSEL modules 
  • Data storage 
  • High-bright/high-power LED arrays 
  • Optoelectronic packaging 
  • LED printhead attachment 
  • Solar concentrator packaging


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