6500 Die BonderDownload the Brochure!
The Palomar 6500 Die Bonder offers a balanced combination of accuracy, speed, and flexibility in a compact system footprint. The 6500 Die Bonder performs ultra-high accuracy eutectic and adhesive placements with cycle times under seven seconds using its four-axis positioning system driven by linear motors gliding over air bearings on a steel based frame.
- P-side down laser diode attachment
- Silicon bench (V-Groove) placement
- High-density RF power transistors
- Ultra-fine pitch hybrid assemblies
- MEMS components
- VCSEL modules
- Data storage
- High-bright/high-power LED arrays
- Optoelectronic packaging
- LED printhead attachment
- Solar concentrator packaging