3880-II Die Bonder

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A solid investment for maximizing productivity – from R&D to volume, automated bonding – all in one bonder. The new Palomar 3880-II die bonder is based on Palomar’s proven die bonder design but includes options to even further maximize productivity, reduce programming time by up to 95%, and improve the overall bonder productivity. The highly flexible Palomar 3880-II is ideally suited for a range of markets and applications.

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Applications
  • AOC - Active optical cable
  • Chip-on-board
  • CMOS sensors
  • GaN/GaAs MMIC
  • HB/HP LED assembly
  • HPLD (high power laser diode)
  • Hybrid microcircuits
  • LiDAR
  • Medical semiconductor & sensors
  • MEMS / MOEMS
  • Microwave modules
  • Power electronics
  • Quantum computing
  • RF GaN 5G power amplifiers
  • RF packages
  • VCSEL, PD, DFB Laser, Lens Attach

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