SST 518 Vacuum/Pressure Furnace

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The SST 518 Vacuum/Pressure furnace provides the right combination of performance and value for use in R&D labs and high mix/low volume production environments. Void-free, flux-free solder joints are reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas.



  • Void-Free Eutectic Die attach
  • Hermetic Package Sealing to MIL-STD
  • Flux-Free Solder Process Development
  • Assembly of High Reliability Microelectronic Packages
  • Hybrid Microelectronic Circuit Assembly
  • Fiber Optic Package Assembly


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