SST 518 Vacuum/Pressure FurnaceDownload the Brochure!
The SST 518 Vacuum/Pressure furnace provides the right combination of performance and value for use in R&D labs and high mix/low volume production environments. Void-free, flux-free solder joints are reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas.
- Void-Free Eutectic Die attach
- Hermetic Package Sealing to MIL-STD
- Flux-Free Solder Process Development
- Assembly of High Reliability Microelectronic Packages
- Hybrid Microelectronic Circuit Assembly
- Fiber Optic Package Assembly