The SST vacuum pressure furnaces are programmable (1200 is semi-automated) systems that utilize vacuum, positive pressure, and tightly controlled thermal cycles to create near zero-void solder joints without flux, resulting in high-reliability electronic components. Clean, user-friendly software combined with detailed run analyzers allows rapid process development and low operation costs.

Systems range from high volume production to low volume research and development tools; can reach chamber pressures as low as 10-7 torr and as high as 60psig; and can consistently heat components to temperatures up to 1000°C. A unique combination of vacuum and high pressure during reflow for optimal solder bond quality and near zero voiding in die attach, substrate attach, and package sealing applications. High performance, flexibility, and throughput for uses ranging from R&D to volume production.