SST 3250 High Vacuum Wafer Furnace

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The SST 3250 is a high vacuum multi-atmosphere sealing furnace that has been designed for lid sealing on wafers of 150-200mm diameter. The system is fully operational at vacuum levels of 10E-07 Torr up to 12 psig with automatic selection and control of up to three process gasses. A closed-loop electronic pressure controller with integral capacitance manometer provides fine control of pressure and flow throughout the full operating range of the system.

SST_3250_left_side_900

 
Applications
  • MEMS Package Sealing
  • Void-Free Eutectic Die Attach
  • Infrared Sensor Package Sealing
  • Low Moisture Package Sealing
  • Wafer Level Packaging
  • Military Electronic Package Sealing

 

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