6532HP Die Bonder
Download the Brochure!The Palomar 6532HP is a high performance die bonder designed for the precise and high volume device assembly requirements of the photonics market. Combining a high volume presentation station with a high precision bonding station, the 6532HP is designed for the demanding device assembly requirements of the photonics market. Components are smoothly and efficiently transferred from presentation station to bonding station with a high speed die shuttle.
Applications
- Chip and Die
- Lasers
- Photo diodes
- Capacitors
- VCSEL arrays
- PD arrays
- LD drivers
- TIA
- Chip on Carrier (CoC, TO, PCB)
- Single or multiple
- Multiple die PIC
- Laser CoC
- Laser or PD on TC
- VCSELs/Drivers/Lens on AOC PCB
- Open Package (GB AA)
- Laser
- TOSA/ROSA
- Receivers
- Modulators
- Complex TC
- AOC
- Finished Modules
- Laser
- Transceiver
- Receiver
- TOSA/ROSA
- Modulator
- AOC