It was the best of times; it was the worst of times. Yet, as always, the need is to make the most of the times. In the world of bonders and ...

Posted by Palomar Technologies MarCom Team on April 12

The headwinds of inflationary trends, pandemic management, internal political tensions, rising competitiveness, supply chain issues, ...

Posted by Palomar Technologies MarCom Team on February 1

Our opening graphic contains three illustrations. Moving from left to right, these are respectively those of a stream engine, a nuclear ...

Posted by Palomar Technologies MarCom Team on October 21

When it comes to the die bonding process for the assembly of RF power transistors, the most important metric is good thermal management. ...

Posted by Palomar Technologies MarCom Team on June 15

As we reflect on the events of 2020 and anticipate their unfolding in 2021, our vision sharpens to reveal a clear trifecta of forces ...

Posted by Palomar Technologies MarCom Team on January 4

Epoxy die attach, sometimes referred to as epoxy die bonding, is the most commonly used die attach method. Whether dispensed or daubed via ...

Posted by Palomar Technologies MarCom Team on August 20

Eutectic die attach involves bonding a chip or die to a surface using a solder alloy. These particular solder alloys are used because of ...

Posted by Palomar Technologies MarCom Team on August 12

Our first blog examined the potential importance of three new technologies on the aerospace market over the next half-decade. These were ...

Posted by Palomar Technologies MarCom Team on May 27

Before the COVID-19 pandemic, passenger numbers had been expected to double over the next 15 years, meaning significant growth in aerospace ...

Posted by Palomar Technologies MarCom Team on May 13

In our last blog on combining bonder and vacuum reflow technologies, we presented a case for how to combine these technologies to ...

Posted by Palomar Technologies MarCom Team on April 29