Stack Die (3D IC) Assembly – Drivers and Challenges
With the increased demand for improved functionality and miniaturization in portable hand-held devices—such as cell phones, PDA, digital ...
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With the increased demand for improved functionality and miniaturization in portable hand-held devices—such as cell phones, PDA, digital ...
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Wafer-Level Packaging (WLP) has become widely accepted in the microelectronics industry due to the demand for smaller form factor in ...
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The objective of RF packaging—where RF (radio frequency) is the range of electromagnetic frequencies above the audio range and below ...
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SEMICON West 2011 was a busy show. Attendance was up, and the flow of people through the packaging exhibit area was steady throughout the ...
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Clean room space is expensive. Obtaining the highest component placement accuracies and the versatility of high-precision application ...
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Palomar Technologies recently exhibited at the 2011 Electronic Components and Technology Conference (better known as ECTC), held this year ...
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The majority of light engines are currently assembled offshore, posing the threat of loosely regulated process flows and an increased risk ...
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MEPTEC MEMS, held this year in the heart of San Jose, CA, is traditionally a niche conference with a small exhibit show floor. This ...
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IMAPS 2009 in San Jose was, as expected, slow due to current economic conditions. It was evident that reduced travel budgets and last ...
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