In microelectronics production environments, bond testing can provide a means of evaluating bond quality and verifying bond consistency and ...

Posted by Janine Hueners on November 13

LEDs 2012 was another well-attended international conference, held at the Hilton on the San Diego bay. Attendance has been up year over ...

Posted by on November 6

Contract microelectronics assembly is all about production, uptime and yield, all of which require production regulation and process ...

Posted by Palomar Technologies MarCom Team on October 23

"Fifty years ago today, 33-year-old GE scientist Dr. Nick Holonyak, Jr., invented the first practical visible-spectrum light-emitting diode ...

Posted by Palomar Technologies MarCom Team on October 16

Throughout the history of electronics manufacturing, there have been distinct boundaries between those that assemble SMT components and ...

Posted by Palomar Technologies MarCom Team on October 9

Automated eutectic attachment is a leading technique for high-performance and high-capacity die attach applications. The needs of the ...

Posted by Palomar Technologies MarCom Team on October 2

The decision process to purchase a high-end, “big ticket item” piece of microelectronics manufacturing equipment is not always a simple ...

Posted by Palomar Technologies MarCom Team on September 25

IMAPS 2012 delivered another great conference covering a wide array of topics. Held this year in San Diego, hundreds of industry peers, ...

Posted by Palomar Technologies MarCom Team on September 18

As microelectronics device designs evolve, so must handling and assembly processes. A common example is with the process of removing ...

Posted by on September 11

Many manufacturing-based businesses are linked to a market of secondary (used), lower-cost equipment. Secondary die attach equipment, such ...

Posted by on August 28