Wire bond interconnects have traditionally been considered "forward" bonded wires. Forward bonding refers to bonding from an integrated ...

Posted by Janine Powell on January 22

Yole Développement recently met with David Rasmussen, Assembly Services general manager, to discuss automated die bonding tools for today's ...

Posted by Palomar Technologies MarCom Team on January 15

It's hard to believe we're already well into the new year. Echoing the happy new year well wishes from our CEO, the entire Palomar ...

Posted by Palomar Technologies MarCom Team on January 8

As the semiconductor industry continues to develop new technologies, our weekly blog provides a lens into the viewpoints and expertise of ...

Posted by Palomar Technologies MarCom Team on December 27

There are a myriad of differences between eutectic or epoxy die attach methods. There are some obvious trade-offs and benefits to both, ...

Posted by Palomar Technologies MarCom Team on December 18

Are you preparing to ramp up production, but not sure how to achieve maximum throughput? How confident are you that your current production ...

Posted by Palomar Technologies MarCom Team on December 4

[For English version, please download the complete article or the introduction to eutectic die attach eBook!] 高精度组件放置的技术 引言 共晶结合是如何形成的 ...

Posted by Palomar Technologies MarCom Team on November 27

This week marks the Thanksgiving holiday, a time to celebrate autumn and give thanks with friends and family. Thanksgiving can also be a ...

Posted by Palomar Technologies MarCom Team on November 20

In microelectronics production environments, bond testing can provide a means of evaluating bond quality and verifying bond consistency and ...

Posted by Janine Hueners on November 13

LEDs 2012 was another well-attended international conference, held at the Hilton on the San Diego bay. Attendance has been up year over ...

Posted by on November 6