Since it was started in 1951 by the National Society of Professional Engineers, National Engineers Week (NEW) is celebrated every third ...

Posted by Janine Powell on February 26

Factory automation is a cost-effective and resource-efficient solution for many complex microelectronic assembly challenges. Factory ...

Posted by Palomar Technologies MarCom Team on February 19

[For English translation, click here.] La fiabilité d’un câblage par la technique nommée « Ball bonding » requière usuellement l’ajout ...

Posted by Palomar Technologies MarCom Team on February 12

With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the ...

Posted by Janine Powell on February 5

Cost and availability of spare parts are of considerate interest to anyone who currently owns a piece of capital equipment or anyone ...

Posted by Palomar Technologies MarCom Team on January 29

Wire bond interconnects have traditionally been considered "forward" bonded wires. Forward bonding refers to bonding from an integrated ...

Posted by Janine Powell on January 22

Yole Développement recently met with David Rasmussen, Assembly Services general manager, to discuss automated die bonding tools for today's ...

Posted by Palomar Technologies MarCom Team on January 15

It's hard to believe we're already well into the new year. Echoing the happy new year well wishes from our CEO, the entire Palomar ...

Posted by Palomar Technologies MarCom Team on January 8

As the semiconductor industry continues to develop new technologies, our weekly blog provides a lens into the viewpoints and expertise of ...

Posted by Palomar Technologies MarCom Team on December 27

There are a myriad of differences between eutectic or epoxy die attach methods. There are some obvious trade-offs and benefits to both, ...

Posted by Palomar Technologies MarCom Team on December 18