As telecommunications and information processing have exploded over the several decades, the need for extremely accurate, high-yield ...

Posted by Palomar Technologies MarCom Team on August 21

With the growing installed base of 3800 Die Bonder customers and the long-standing presence of the 8000 Wire Bonder across the APAC region, ...

Posted by Palomar Technologies MarCom Team on August 14

The search for a "complete, yet customized, solution to a microelectronics assembly requirement" is an all-too-common request from a ...

Posted by Palomar Technologies MarCom Team on August 7

With the ever-evolving trend for smaller applications, the capability to produce high-precision, high-reliability component bonding remains ...

Posted by Palomar Technologies MarCom Team on July 31

SEMICON West is the flagship annual event for the microelectronics industry, with 2012 bringing together 690 exhibiting companies from 21 ...

Posted by Palomar Technologies MarCom Team on July 24

To live today without the assisitance and support of microelectronic-controlled devices is borderline unthinkable—unless you are romantic ...

Posted by Palomar Technologies MarCom Team on July 17

"Unleash the RF/Microwaves!" There was an a recent ad in the Microwave Journal that proclaimed this, but it could be the rallying cry at ...

Posted by Palomar Technologies MarCom Team on June 26

While 3D packaging and reliability was a reoccurring topic throughout the ECTC 2012 exhibit hall conversations, traditional 2D packaging ...

Posted by Palomar Technologies MarCom Team on June 5

SMT Hybrid Packaging is Europe's leading event on system integration in microelectronics. From 8–10 May, 2012, over 565 exhibitors ...

Posted by Palomar Technologies MarCom Team on May 22

Mobile electronic products continually require finer geometries for packaged integrated circuits. Wireless phones, PDA and digital cameras ...

Posted by Palomar Technologies MarCom Team on May 15