A Weekly Lens on Semiconductor Packaging
As the semiconductor industry continues to develop new technologies, our weekly blog provides a lens into the viewpoints and expertise of some of the industry’s leading engineers and technical liaisons. Thank you for your subscription to the PTI Blog and your support of this growing online resource.
Revisiting the 2012 Guest Blogs
In addition to our discussions of high-precision die attach and wire bonding solutions and applications, the 2012 PTI Blog was an amplification of our strong ties with other leading manufacturers in the industry. I encourage you to revisit some of our 2012 guest blogs:
- Flip Chip & MEMS Assembly with High-Mix, Automatic Die Sorters (Royce Instruments, Inc.)
- Accurate Bond-Line Thickness for Enhanced Performance of Critical Die (Hybond, Inc.)
- Micro-Dot Epoxy Pump Dispenser - GPD Fluid Dispense Solution (GPD Global)
- The VubIQ NHL GoalCam Project (VubIQ)
- European Contract Assembly for High-Mix, Low-/Medium-Volume (Optocap)
Again, thank you for your subscription and continued participation on the PTI Blog. We look forward to sharing and connecting with you throughout the New Year!
I wish you a happy and healthy start to 2013.
Best regards,
Bruce Hueners
President & CEO
Palomar Technologies, Inc.
