[For the English version, click here.] Gold (Au) Ball- Drahtbonden ist immer noch die beherrschende Verbindungsmethode in der ...

Posted by Janine Powell on May 7

Multi-Chip Module packaging is an important facet of modern electronic miniaturization and micro-electronic systems. Demand for further ...

Posted by Janine Powell on April 30

The increasingly densely populated and higher power levels of RF & Optoelectronic packages are creating unique challenges for assembly ...

Posted by Janine Powell on April 23

Gold (Au) ball wire bonding is still the predominate method for interconnects in microelectronics. Industries are further utilizing novel ...

Posted by Janine Powell on April 16

Today’s microelectronic manufacturing environments seem to be constantly changing. One day you are building up traditional “flat-land” ...

Posted by Janine Powell on April 9

Have you ever had an ink jet printer that no matter what you did to calibrate it, you still had a bit of a blur? How you must have cringed ...

Posted by Janine Powell on April 2

SEMICON China celebrated its 25th year, held this year at the Shanghai New International Expo Center on March 19-21. Mr. PH Chan, Palomar ...

Posted by Janine Powell on March 26

Why is high accuracy required? And why is high accuracy important? In the context of bonding directly to wafer, +/- 1.5um allows for ...

Posted by Palomar Technologies MarCom Team on March 19

A consultant can be a very vital component on a company’s road to success. Bringing in a professional that provides expert advice in their ...

Posted by Janine Powell on March 12

[For the English version, click here.] ...

Posted by Janine Powell on March 5