It's hard to believe we're already well into the new year. Echoing the happy new year well wishes from our CEO, the entire Palomar Technologies team wishes you a prosperous 2013.
Highlights from 2012
Palomar Technologies is in the third year of teaming up with GPD (Global Precision Dispensing) Systems, Royce Instruments bond testers and die sorters, and Hybond manual bonders. While Palomar offers alliance system solutions and products separately, these machines are often packaged together with a die and/or wire bonder. For example, the GPD dispenser can be integrated into a production line with a 3800 Die Bonder or 6500 Die Bonder. The integration increases throughput, and ultimately lets "the bonder do the bonding". The Royce testers make excellent off-line solutions to everything from die sorting to wire/shear testing. And lastly, the Hybond machines are a perfect solution for low-volume bonding.
The 3800 Die Bonder continues to lead as a large work area, high-accuracy, production-ready die attach platform. Since its launch in mid-2010, the 3800 Die Bonder has handled applications and processes ranging from optoelectronic devices, RF modules, HB/HP LED, and automotive sensors, just to name a few. In 2012, processes were refined in ACP for flip chip attachment, high-accuracy of optical components and direct chip attach, as well as successfully handled ever smaller die. Additionally, the development of Cognex’s Patmax allows location of randomly oriented die. Palomar continues to offer a wide range of efficient presentation methods such as tape and reel, wafer, and epoxy and eutectic conveyors to meet the broad range of requirements for the die attach customer. Work continues with SnPB solder, AuSi eutectic scrub, and AuSn eutectic solder attach to meet new requirements for high power packages.
With increasing requirements for high-accuracy die attach (1.5um – 3um), the 6500 Die Bonder has been uniquely positioned to solve these ultra-high accuracy challenges at both the epoxy and eutectic level. The 6500 Die Bonder improved software features enhance throughput and repeatability while maintaining accuracy. Just like the 3800 Die Bonder, the 6500 Die Bonder can accommodate multiple presentation methods, including automated waffle/gel pak feeders. For P-side down laser attach, disk drive, optoelectronic packages and many other high accuracy applications, customers find a production-ready home with the 6500 Die Bonder.
The 8000 Wire Bonder continues to be the most versatile, deep access, high-speed wire bonder on the market today. This machine continues to surpass even the expectations of Palomar's own engineers! Because this machine is so versatile—and because its installed base is so large—new developments for odd form or deep packages, improved yields, and improved overall package quality for greater efficiency and reduced costs are continually reached and well documented.
Palomar Technologies Assembly Services, the prototyping, process developing and small/medium contact assembly division of Palomar Technologies has also had a successful year of both new product/process developments and meeting the contract production demands of customers worldwide. Palomar Technologies is the only OEM in the world that can offer the same high-accuracy wire and die attach services it applies to its equipment. Many customers start in our Assembly Services lab to build, test and qualify parts, and even begin to supply completed arts to their customers prior to moving to a full-scale production—either to their own facility or to a sub-con in the U.S., Mexico, Asia, etc. This is a low-risk, high reward strategy.
Looking ahead in 2013, Palomar Technologies' first priority remains to solve micro-optoelectronic challenges by not only providing world class equipment, but to also support and develop robust processes through proper bonder training, successful equipment installations (which meet customer requirements), long-term support of equipment, and process optimization. Certainly if new requirements arise, Palomar can help accommodate those changes as well. Challenge us with your microelectronics packaging needs: www.palomartechnologies.com/contact-us
Best wishes in 2013.
----
Richard Hueners
Marketing & Systems Sales Manager
Palomar Technologies, Inc.