Almost everyone has heard the saying “worth its salt”, meaning whatever has been purchased, the financial cost was more than justified by ...

Posted by Palomar Technologies MarCom Team on June 30

The journey from concept to full-scale semiconductor packaging is often hindered by a number of different obstacles along the way including ...

Posted by Palomar Technologies MarCom Team on June 14

Palomar Technologies recently sent two delegates to EPIC’s Packaging Conference, hosted by ASM Amicra, in Regensburg, Germany. The annual ...

Posted by Palomar Technologies MarCom Team on July 22

Find out more about what Palomar Technologies Assembly Services™ has to offer, or contact us for more details. ---- Nick Evans Applications ...

Posted by Palomar Technologies MarCom Team on October 24

Photonic integrated circuits (PIC) have become an attractive platform for data center, sensing and medical devices. Thermal cameras and ...

Posted by Palomar Technologies MarCom Team on September 11

Gold ball bumping is primarily used to make interconnects for flip chip bonded die. This process involves placing a single bump (or stacked ...

Posted by Janine Powell on September 12

Sometimes we get requests from customers or potential customers needing a bonder right away. Of course, we try to do everything we can to ...

Posted by Janine Powell on May 9

Palomar has successfully worked with the global contract manufacturer Fabrinet over the last several years, working with our mutual ...

Posted by Janine Powell on March 14

[Read the English version of the blog here.] Bien que la tendance évolue défavorablement envers le fil d’or dans le câblage de grande ...

Posted by Janine Powell on January 17

Due to the accuracy and flexibility of our systems (along with the decades of experience and knowledge of our staff), we often get to work ...

Posted by Janine Powell on November 1