Total Risk Mitigation in Microelectronic Packaging

Microelectronic programs come with many forms of risk. If the design is manufacturable, the list is reduced, but a number of items still ...

Posted by Janine Powell on July 22

Gold (Au) Wire Bonding and the Rise of Copper (Cu) Wire

Though the trend is moving away from gold wire for high-volume production wire bonding, gold ball wire bonding still makes up about 50 ...

Posted by Janine Powell on February 11

The ABCs of LEDs – Starting with “A”

Light emitting diode (LED)-based applications are growing, and cover a broad range of markets. LEDs are bright, efficient, and quick to ...

Posted by Janine Powell on October 16

Automated Flip Chip Assembly

Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and ...

Posted by Janine Powell on July 23

Sourcing Process Expertise for High-Precision Assembly

Near-sourcing, out-sourcing, in-sourcing, crowd-sourcing, group-sourcing—which one is right for your organization? Palomar Technologies' ...

Posted by Janine Powell on July 2

Multi-Chip Modules & Stacked Die Assemblies

Multi-Chip Module packaging is an important facet of modern electronic miniaturization and micro-electronic systems. Demand for further ...

Posted by Janine Powell on April 30

Automated Die Bonding Supports Demanding LEDs Requirements

Yole Développement recently met with David Rasmussen, Assembly Services general manager, to discuss automated die bonding tools for today's ...

Posted by Palomar Technologies MarCom Team on January 15

Challenge Us with Your Microelectronics Packaging Needs in 2013

It's hard to believe we're already well into the new year. Echoing the happy new year well wishes from our CEO, the entire Palomar ...

Posted by Palomar Technologies MarCom Team on January 8

Reduce Production Time-to-Market

Are you preparing to ramp up production, but not sure how to achieve maximum throughput? How confident are you that your current production ...

Posted by Palomar Technologies MarCom Team on December 4