The earlier blogs in this series highlighted a number of pressing dynamics in the current direction of the RF power packaging ecosystem, ...

Posted by Dr. Anthony O'Sullivan on February 18

In the third part of this blog series, we outline our technical success in demonstrating the use of jet dispensed silver sintering. As we ...

Posted by Dr. Anthony O'Sullivan on January 23

In this second blog on pressure-less silver sintering, we set out aspects of the development work we undertook at our Innovation Center in ...

Posted by Dr. Anthony O'Sullivan on December 17

Silver sintering technology has been around since the 1980s, but the process has faced numerous problems. The limits of traditional ...

Posted by Dr. Anthony O'Sullivan on November 25

There is a multi-trillion-dollar market developing around the world through the adoption of disruptive technology in driverless vehicles. ...

Posted by Palomar Technologies MarCom Team on March 26

The semiconductor packaging industry continues a relentless pursuit to make smaller packages with higher throughput. The industry demand ...

Posted by Palomar Technologies MarCom Team on January 17

Photonic integrated circuits (PIC) have become an attractive platform for data center, sensing and medical devices. Thermal cameras and ...

Posted by Palomar Technologies MarCom Team on September 11

Often customers are wrestling with the question of which option makes more sense in their given business environment: a manual system, ...

Posted by Janine Powell on November 28

The differences between eutectic and epoxy die attach are many. There are some obvious trade-offs and benefits to both, most of which ...

Posted by Janine Powell on September 20

With more than 700 exhibitors and more than 26,000 participants, SEMICON West is one of the largest technical conferences that Palomar ...

Posted by Janine Powell on July 12