In the early part of 2021, global analysts McKinsey & Company published a number of articles noting that the COVID crisis has led, ...

Posted by Palomar Technologies MarCom Team on April 12

This is the first in a 3-part blog series exploring the world of quantum technologies and its impact on semiconductor packaging. With the ...

Posted by Palomar Technologies MarCom Team on March 29

Much of the semiconductor packaging industry is engaged with an exciting and growing photonics ecosystem. Anticipating seven percent CAGR ...

Posted by Palomar Technologies MarCom Team on March 15

“Necessity”, quips the proverb, “is the mother of invention.” Put colloquially, if you are desperate enough to attain a particular goal, ...

Posted by Palomar Technologies MarCom Team on February 15

“New space technologies … will bring about fundamental change that will influence business and our personal lives.” George Whitesides, ...

Posted by Palomar Technologies MarCom Team on February 1

As we reflect on the events of 2020 and anticipate their unfolding in 2021, our vision sharpens to reveal a clear trifecta of forces ...

Posted by Palomar Technologies MarCom Team on January 4

The year of 2020 will no doubt go down in history as one of the most difficult, life-changing years of the past century. At the beginning ...

Posted by Palomar Technologies MarCom Team on December 22

Process development can present many challenges in the die attach market when the optimal process or package design varies drastically. ...

Posted by Palomar Technologies MarCom Team on October 27

Epoxy die attach, sometimes referred to as epoxy die bonding, is the most commonly used die attach method. Whether dispensed or daubed via ...

Posted by Palomar Technologies MarCom Team on August 20

Eutectic die attach involves bonding a chip or die to a surface using a solder alloy. These particular solder alloys are used because of ...

Posted by Palomar Technologies MarCom Team on August 12