An advanced packaging capital equipment supplier’s technical prowess grows by providing successful solutions to customers over many years. ...

Posted by Katie Finney on April 7

There has been a recent upsurge in photonic packages used for fiber-optic communication. Fiber-optics has several distinct advantages over ...

Posted by Katie Finney on March 31

The intricate packaging process for optoelectronic devices can challenge the efforts to reduce manufacturing costs. Since the goal of an ...

Posted by Katie Finney on February 10

At Palomar Technologies we often discuss the versatility of our equipment, as we have many uniquely adaptable and accurate approaches to a ...

Posted by Katie Finney on January 20

For applications that have strict temperature parameters, eutectic die attachment is typically the best solution. Epoxies and other fluid ...

Posted by Janine Powell on December 16

Here is a quick refresher on epoxy die attach and Anisotropic Conductive Paste (ACP). Using a flexible die bonder with 3 channels of fluid ...

Posted by Janine Powell on September 23

[For the English version, click here.] 超过5000人参加了最近战略光技术的15周年会议，超过200家公司展出- 包括了Palomar Technologies ...

Posted by Janine Powell on September 9

Microelectronic programs come with many forms of risk. If the design is manufacturable, the list is reduced, but a number of items still ...

Posted by Janine Powell on July 22

Palomar recently exhibited at two very high tech shows in Florida: Electronics Component and Technology Conference (ECTC) and the ...

Posted by Janine Powell on June 17

There has been a resurgent growth in the fiber communications industry over the last few years. Much of this is to support higher bandwidth ...

Posted by Janine Powell on May 13