Today’s multipurpose wire bonding machines are required to deliver a combination of wires, bumps and specialty interconnects. Multipurpose ...

Posted by Palomar Technologies MarCom Team on July 15

The SEMICON West 2011 show floor has been buzzing with confidence and optimism for the microelectronic packaging industry. “SEMICON West is ...

Posted by Palomar Technologies MarCom Team on July 14

最有效的生产到上市模式 - Palomar 的封装服务部门是美国极少数有能力提供全方位封装服务的实验室。该实验室设在Palomar南加州Carlsbad的总部。实验室内采用了公司本身最精密，最先进的贴片机和球焊机。其他设備还包括了 GPD 的点胶机和 Royce ...

Posted by Palomar Technologies MarCom Team on July 11

Clean room space is expensive. Obtaining the highest component placement accuracies and the versatility of high-precision application ...

Posted by Palomar Technologies MarCom Team on June 28

Through decades of experience with automatic, highly versatile and precise die attach systems, I have learned a few important lessons in ...

Posted by Palomar Technologies MarCom Team on June 19

Palomar Technologies recently exhibited at the 2011 Electronic Components and Technology Conference (better known as ECTC), held this year ...

Posted by Palomar Technologies MarCom Team on June 8

The majority of light engines are currently assembled offshore, posing the threat of loosely regulated process flows and an increased risk ...

Posted by Palomar Technologies MarCom Team on June 2

MEPTEC MEMS, held this year in the heart of San Jose, CA, is traditionally a niche conference with a small exhibit show floor. This ...

Posted by Palomar Technologies MarCom Team on May 23

Situated in the heart of Bavaria and with over half a million inhabitants, Nuremberg is one of Europe’s most beautiful cities, rich in ...

Posted by Palomar Technologies MarCom Team on May 5

Applications requiring ultra-high-placement accuracies of 1μm to 3μm are resurfacing in several optoelectronic applications such as Arrayed ...

Posted by Palomar Technologies MarCom Team on April 28