Semiconductor packaging industry experts are continually reworking designs to reduce application package size—however, there remain a significant number of applications which require a wildly different set of capabilities for wire bonding.
Odd-Form factor applications have significantly different inputs and requirements than typical semiconductor packaging applications. One of the primary characteristic differences between semiconductor and odd-form factor wire bonder requirements includes the work area range in XY and the Z axes. Semiconductor machines typically use a hitch feed style handler to pull segments of the parts into position for a limited bonding area while the large workspace of the odd-form style machine can bond all of the parts in a 6 by 12 inch area in one pass.
This image shows RFSOE chain wires with loop control and sequence order control
Palomar Technologies senior scientist, Daniel Evans, discusses the differences in parts and capabilities between semiconductor and odd-form factor part (hybrid) wire bonding machines in a technical whitepaper. The odd-form factor wire bonders in this paper have larger work space and handle a wider range of part sizes, meeting the packaging requirements that simply cannot be bonded on semiconductor bonders.
Three case studies highlight the primary challenges and solutions in odd-form package assembly:
Case 1: Deep Access 0.535”
Case 2: Ambient Wire Bonding to a 6” Tall Package
Case 3: Batch Load Tray (mechanical and vacuum clamping)
The cases are presented to show the challenges and solutions to wire bond packages in the RF, automotive and optical markets with large form factor (12 x 6 inch), deep reach (0.535 inch), leads and pins.
Download the "Odd-Form Factor Package Wire Bond Case Studies" whitepaper to learn more.
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Jessica Sylvester
Marketing Communications
Palomar Technologies