SEMICON China 2011 Reflection | Showcasing the 3500-III Die Bonder

美国PALOMAR 公司成立于1975年,早期隶属于美国休斯航空公司(Hughes Aircraft )的工业产品事业部,主要从事半导体设备的开发与研究.PALOMAR 公司至成立之日就致力于服务美国军工和高科技企业领域高端封装设备的供应.在该领域有70%以上的市场.

Palomar Technologies just completed an exciting and successful three-days at SEMICON China 2011. As in past years, the SEMICON China conference utilizes an enormous venue filled with equipment, suppliers and customers searching for the solution to their microelectronic packaging challenges. SEMICON China 2011 suppliers spanned the venue exhibit hall featuring processes and support tools, materials and services geared toward the manufacturing of current and mature technology products (as opposed to bleeding edge processes).

Semicon China 2011 Palomar Technologies booth

Palomar Technologies co-exhibited in AST’s booth. Along with the seven or so local AST sales representatives, Palomar Technologies’ CEO (Bruce Hueners), Senior Scientist (Dan Evans) and Palomar Asia Director (PH Chan) were all in attendance and fully engaged in discussions with customers with interpretation assistance from AST personnel. The one-on-one conversations provided a clear understanding that the conference attendees were very eager to learn more about Palomar Technologies equipment and processes. The conversations often included drawings, sketches and math, which broke down the language differences very quickly!

wire bond and die attach discussions are SEMICON China 2011

AST stood out as a booth supplying manual and automatic equipment and process for complex hybrid MCM, RF, microwave, millimeter wave, optoelectronic, MEMS sensor and other similar packaging solutions. Palomar Technologies showcased a high-accuracy component placement system, the 3500-III Die Bonder, which sparked a wake of high interest among conference attendees. The 3500-III Die Bonder is capable of such processes as AuSi eutectic scrub and AuSn eutectic solder attach. In addition to 3500-III Die Bonder, Palomar Technologies’ alliance partners Royce Instruments and Hybond offered live demonstrations of their bond testing equipment.

Microelectronics presentation in Shanghai by Palomar Technologies

SEMICON China 2011 was a successful event for Palomar Technologies to discuss, share and explore viable microelectronic packaging solutions for the growing market in Asia.

----
Jessica Sylvester
Marketing Communications
Palomar Technologies