Have your engineers ever encountered challenges with locating parts while working with a die or wire bond application? This can be a ...

Posted by Janine Powell on August 23

With over 30 years in the business, Palomar Technologies and Royce Instruments both have a rich history of microelectronics equipment ...

Posted by Janine Powell on August 16

Hybrid components and high-power communication devices are classified as high-performance and high-capacity die attach applications. These ...

Posted by Janine Powell on August 9

SEMICON West 2016 in San Francisco, CA was a great success! In the Palomar Technologies booth, we had live demonstrations of our 9000 Wedge ...

Posted by Katie Finney on August 2

The QuikCool rate profile achieves lower void concentration versus normal rate profile in AuSn solder alloys. AuSn is the “best” alloy to ...

Posted by Julia Picarelli on July 28

[For the English version, click here.] В течение многих лет разварка проволочных перемычек является самым надежным и широко используемым ...

Posted by Janine Powell on July 19

With more than 700 exhibitors and more than 26,000 participants, SEMICON West is one of the largest technical conferences that Palomar ...

Posted by Janine Powell on July 12

In wire bonding, a gold ball is forced down and thermosonically bonded to a die-bond pad forming the first connection of an integrated ...

Posted by Janine Powell on June 28

The Conference on Lasers and Electro-Optics (CLEO) 2016 was the last of the “big three” photonics shows in the US (Photonics West, OFC, and ...

Posted by Janine Powell on June 21

In part three of this series we will continue looking at the various methods for determining the leak rate of microelectronic devices with ...

Posted by Julia Picarelli on June 16