In general, there are two main types of ultrasonic wire bonding: ball bonding and wedge bonding. Although thermosonic gold ball bonding is ...

Posted by Janine Powell on April 13

As we continue this series on the Methods of Testing Device Hermeticity According to MIL-STD-883, we will start looking at the various ...

Posted by Julia Picarelli on April 8

March was a busy month for Palomar Technologies with exhibiting at both the iMAPS Device Packaging and OFC 2016 technical conferences. The ...

Posted by Katie Finney on April 5

The SST Family of Furnaces has the ability to store hundreds of profile recipes. Most customers, however, only have a handful of commonly ...

Posted by Julia Picarelli on March 25

Purchasing an automatic die bonder and/or wire bonder is a significant financial investment. To help ensure your company's financial ...

Posted by Katie Finney on March 1

SST recommends, designs, and fabricates tooling for die attach and lid seal with weights. Free floating individual weights are used for ...

Posted by Julia Picarelli on February 26

Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, will be exhibiting at ...

Posted by Katie Finney on February 23

SST International utilizes graphite, among other materials, for tooling of microelectronics parts packaging. The superior characteristics ...

Posted by Katie Finney on February 16

[For a version of this blog in English, click here] 在上世纪70年代，当Palomar Technologies ...

Posted by Katie Finney on February 9

Computer and software performance is vital to maintaining peak production performance, especially for complex hybrid manufacturing. ...

Posted by Katie Finney on February 2