Moisture on microelectronic components has a history of failure-inducing effects. These include electrical leakage, corrosion of metal ...

Posted by Janine Powell on May 24

Designers of electronic packages require that their components be located very precisely; however, sometimes the positional tolerance of ...

Posted by Julia Picarelli on May 20

Do you happen to know someone who does not own some type of wireless device? It is becoming rarer today to meet someone who does not. ...

Posted by Janine Powell on May 17

[For the English version, click here.] Palomar 公司SST 国际推荐，设计，并制作有加上重量, ...

Posted by Janine Powell on May 10

We have the privilege and opportunity to work with customers who are ready to make the leap from a manual production environment to a fully ...

Posted by Janine Powell on May 3

[For the English translation, click here.] Les machines de câblage de Palomar Technologies utilisent depuis plusieurs années la technologie ...

Posted by Janine Powell on April 26

Having the right preform size affects yield in a big way. Preform suppliers offer custom size preforms, and with existing in-house tooling ...

Posted by Julia Picarelli on April 22

In general, there are two main types of ultrasonic wire bonding: ball bonding and wedge bonding. Although thermosonic gold ball bonding is ...

Posted by Janine Powell on April 13

As we continue this series on the Methods of Testing Device Hermeticity According to MIL-STD-883, we will start looking at the various ...

Posted by Julia Picarelli on April 8

March was a busy month for Palomar Technologies with exhibiting at both the iMAPS Device Packaging and OFC 2016 technical conferences. The ...

Posted by Katie Finney on April 5