PTI Blog

Yole Développement recently met with David Rasmussen, Assembly Services general manager, to discuss automated die bonding tools for today's ...

Posted by Palomar Technologies MarCom Team on January 15

Throughout the history of electronics manufacturing, there have been distinct boundaries between those that assemble SMT components and ...

Posted by Palomar Technologies MarCom Team on October 9

With the ever-evolving trend for smaller applications, the capability to produce high-precision, high-reliability component bonding remains ...

Posted by Palomar Technologies MarCom Team on July 31

Having undergone significant changes since the collapse of the Soviet Union, Russia is moving from a centrally planned economy to a more ...

Posted by Palomar Technologies MarCom Team on March 27

The medium used for component attach is key aspect of LED assembly. There is ample evidence that gold-tin (Au/Sn) yields the highest ...

Posted by on February 28

Although there is continued effort in the semiconductor packaging industry to reduce package size along with the never-ending pursuit of ...

Posted by Palomar Technologies MarCom Team on December 20

Since the early 1990s, halogen or xenon HID (high intensity discharge) lamps have been the most widely chosen light source in motor vehicle ...

Posted by on December 6

High Bright Light Emitting Diodes (HB LEDs) are one of the fastest growing technologies in the world. Industrial, aerospace, utilities and ...

Posted by Palomar Technologies MarCom Team on October 26

Well, it is that time of year again. This week is the 44th International Symposium on Microelectronics - IMAPS 2011. This year's conference ...

Posted by Palomar Technologies MarCom Team on October 12

The SEMICON West 2011 show floor has been buzzing with confidence and optimism for the microelectronic packaging industry. “SEMICON West is ...

Posted by Palomar Technologies MarCom Team on July 14

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