The SEMICON West 2011 show floor has been buzzing with confidence and optimism for the microelectronic packaging industry. “SEMICON West is experiencing a rebound from the past couple of years, with nearly a 10 percent increase in booths and several hundred companies demonstrating real products [and solutions] on the show floor,” stated the SEMICON West Daily News. Semi EVP, Jonathon Davis, voiced an expected forecast of “strong growth in the semiconductor market” over the next few years, with expectations for the industry to rise from $314 billion in 2011 to $375 billion by 2014 (according to the World Semiconductor Trade Statistics (WSTS) Council).
Palomar Technologies has been a 35-year exhibitor at SEMICON West, and the on-site team is definitely feeling the pulse of excitement as the conference nears the closing day.
What’s hot this year? LEDs—specifically HB LEDs modules—have been a consistent topic among the booth attendees. Assembly Services, the contract assembly, prototyping, test and development division of Palomar Technologies, has refined a rigorous process flow for precision contract assembly of HB LEDs. Watch the on-demand webcast describing this proven process flow backed by decades of process expertise and a series of highly regulated certification steps to ensure product and time-to-market success in high-volume, high-reliability commercial HB LED production.
More SEMICON West hot topics? Ultra fine pitch and hi-rel wire bonds and ball bumping were repeat conversation topics in the Palomar Technologies booth this year. The 12x6” large work area 8000 Wire Bonder—capable of cycle time of 0.125 sec/wire, 0.077 sec/bump and a placement accuracy of +/- 2.5 micron, 3 sigma—truly met the discussed needs for automated wire bonding and odd-form/complex packaging.
With one more day ahead, the Palomar Technologies team is gearing up for another successful closure on the SEMICON West exhibitors’ show floor.
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Jessica Sylvester
Marketing Communications
Palomar Technologies