With the ever-evolving trend for smaller applications, the capability to produce high-precision, high-reliability component bonding remains imperative. Palomar Technologies Assembly ServicesTM ("Assembly Services") general manager, Donald Beck, recently sat down with Yole Développement for a focused discussion on the value of automated packaging processes for ultra high-precision applications.
Mr. Beck explained that the majority of Palomar's end application development can be classified as "advanced" or "complex". "Electronics assembly" can umbrella many organizations and OEMs, but there is a component of that group into which Palomar falls that does the really difficult "stuff" such as odd-form deep access wire bonding, high-accuracy wafer level packaging, or even highly secured assembly services laboratories with computerized production monitoring and management.
High-accuracy requirements are seen especially in photo diode, laser module and some LED designs. LED light engine designs requiring sub-3μm placement requirements tend to be designs with focus lenses so that alignment of the LEDs to the lens is critical.
In addition, the emergence of Micro- Ball Grid Arrays (BGAs) follows the trend of "as designs shrink, the need for high accuracy grows." Some surface mount assemblies where an SMT assembler can support all needs up until the Micro-BGA would then require support through the Assembly Services division. Palomar can support true automation for sub-3μm applications on our fully automated, ultra high-precision 6500 Die Bonder platform, which produces industry-leading throughput at that accuracy. Wafer level packaging (WLP) (also known as wafer scale packaging), is supported through Palomar’s own Pulsed Heat System (PHS) tool and stage designs as well as a WLP configuration on the 6500 Die Bonder. The Palomar PHS tool enables pick/place and reflow die onto a single wafer without affecting the position or attach integrity of a previously placed die.
The ability to support sub-3μm requirements requires a novel assembly design with crisp, consistent features on components. The biggest trade-off is that not all device designs will support high accuracy. Of course, there may be some added cycle time depending on the level of inspection/measurement required.
Palomar is also known for our ability to assemble large area and deep access assemblies—especially those found in highly complex RF and optoelectronic packages.
Palomar is a leader in eutectic die attach with the ability to perform high-precision processes on work areas that are approximately 40% larger than other available systems today. The ability to assemble complex—or large—area packages with either epoxy or eutectic attach allows Palomar to serve a wide customer base as well as to stay on the leading edge of new technology development.
Read the complete Yole Développement interview: The Value of Automation for Ultra High-Precision Applications.
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Jessica Sylvester
Marketing Communications
Palomar Technologies, Inc.