Well, it is that time of year again. This week is the 44th International Symposium on 
Microelectronics - IMAPS 2011. This year's conference was well attended, with technical talks on trending topics such as 3D packaging, Next Gen materials, MEMs and LEDs. Palomar Technologies was one of 130 companies exhibiting this year. Palomar delivered two HB LED technical talks, and is honored to have won the IMAPS 2011 Corporate Recognition Award!
Download Palomar’s IMAPS 2011 technical paper “Automated Precision Assembly for High-Volume HB LEDs” to learn more about the tightly regulated process flow employed by 
Palomar Assembly ServicesTM (“Assembly Services”), the contract manufacturing division of Palomar Technologies.
Some IMAPS History
The IMAPS conference started back in 1967, and actually under a different name: International Society for Hybrid Microelectronics, or ISHM. In 1997, ISHM and the International Electronic Packaging Society (IEPS) officially merged and began operating as the International Microelectronic Packaging Society, or IMAPS. ISHM typically focused on complex hybrid microelectronic packaging, but after the merger with IEPS, IMAPS broadened its focus to include other electronic packaging challenges.
Just as ISHM developed and grew into IMAPS, Palomar Technologies grew out of Hughes Aircraft Company. Many changes have occurred over the past several decades of process expertise and bonder system development, but the common theme has been consistent – "to enable our customers to overcome their Microelectronic Assembly Challenges in a cost effective manner." Today, Palomar Technologies is a premier provider of high-reliability solutions for complex electronics assembly applications, having been built on the Hughes Aircraft foundation of a defense-based, engineering-driven enterprise.
Precision HB LED Assembly
Assembly Services, led by Don Beck, reports continued growth in the LED packaging industry. Assembly Services generate new processes, build rapid prototypes and processes small- to medium-volume contract manufacturing in many areas, including HB LED packaging. 
Because HB LEDs are driven hard to produce as many lumens as possible, they generate a thermal problem. Excess heat has to be managed or the assembly will be short-lived. High thermally conductive epoxies and eutectic solders are the main methods for conducting this heat away from the active devices. Palomar Technologies offers a high-accuracy Pulsed Heat System for high-reliability eutectic die attach on the 3800 Die Bonder.
Once eutectic die attach is complete, an HB LED application can be transferred to the fully automatic hi-rel wire/ball bonder, the 8000 Wire Bonder. 
Using stand-off stitch bonding, we can generate wires that destruct at the tensile strength of the bonding wire over 90% of the time. This smart bonder can determine its own fitness within minutes during certification at the start of a shift.
Visit the Palomar team of die attach, wire bond and hi-rel HB LED packaging experts at IMAPS 2011 at booth 231 in Long Beach, CA. We are available to discuss your advanced packaging needs in detail – whether a systems solution or Assembly Services, or a mix of both. Not able to make the show this year? We’re always available to answer your most challenging microelectronic questions…contact us today or follow us on twitter @PalomarTech!
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Bradley Benton
Western North America Regional Sales Manger
Palomar Technologies