[For English translation, click here.] La fiabilité d’un câblage par la technique nommée « Ball bonding » requière usuellement l’ajout ...
Posted by Palomar Technologies MarCom Team on
With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the ...
Posted by Janine Powell on
Wire bond interconnects have traditionally been considered "forward" bonded wires. Forward bonding refers to bonding from an integrated ...
Posted by Janine Powell on
It's hard to believe we're already well into the new year. Echoing the happy new year well wishes from our CEO, the entire Palomar ...
Posted by Palomar Technologies MarCom Team on
IMAPS 2012 delivered another great conference covering a wide array of topics. Held this year in San Diego, hundreds of industry peers, ...
Posted by Palomar Technologies MarCom Team on
With the growing installed base of 3800 Die Bonder customers and the long-standing presence of the 8000 Wire Bonder across the APAC region, ...
Posted by Palomar Technologies MarCom Team on
SEMICON West is the flagship annual event for the microelectronics industry, with 2012 bringing together 690 exhibiting companies from 21 ...
Posted by Palomar Technologies MarCom Team on
To live today without the assisitance and support of microelectronic-controlled devices is borderline unthinkable—unless you are romantic ...
Posted by Palomar Technologies MarCom Team on
SMT Hybrid Packaging is Europe's leading event on system integration in microelectronics. From 8–10 May, 2012, over 565 exhibitors ...
Posted by Palomar Technologies MarCom Team on
Mobile electronic products continually require finer geometries for packaged integrated circuits. Wireless phones, PDA and digital cameras ...
Posted by Palomar Technologies MarCom Team on
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