It is safe to say that any organization utilizing an automated wire bonder continually strives to increase productivity and efficiency. ...

Posted by Janine Powell on July 30

SEMICON West 2013 is barely two weeks away; attendees are just days away from over 50 hours of technical programs and focused access to ...

Posted by Janine Powell on June 25

[For English, click here.] 为了提高第二焊接点的可靠性，传统上是在第二个焊接点上焊上一个球(security bond)。虽然这种方法确实创造一个更可靠的焊线，它同时也导致产量的下降。这方法只能使用正向的焊线动作。 ...

Posted by Palomar Technologies MarCom Team on June 4

Today’s microelectronic manufacturing environments seem to be constantly changing. One day you are building up traditional “flat-land” ...

Posted by Janine Powell on April 9

SEMICON China celebrated its 25th year, held this year at the Shanghai New International Expo Center on March 19-21. Mr. PH Chan, Palomar ...

Posted by Janine Powell on March 26

Why is high accuracy required? And why is high accuracy important? In the context of bonding directly to wafer, +/- 1.5um allows for ...

Posted by Palomar Technologies MarCom Team on March 19

[For English translation, click here.] La fiabilité d’un câblage par la technique nommée « Ball bonding » requière usuellement l’ajout ...

Posted by Palomar Technologies MarCom Team on February 12

With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the ...

Posted by Janine Powell on February 5

Wire bond interconnects have traditionally been considered "forward" bonded wires. Forward bonding refers to bonding from an integrated ...

Posted by Janine Powell on January 22

It's hard to believe we're already well into the new year. Echoing the happy new year well wishes from our CEO, the entire Palomar ...

Posted by Palomar Technologies MarCom Team on January 8