SEMICON China celebrated its 25th year, held this year at the Shanghai New International Expo Center on March 19-21. Mr. PH Chan, Palomar ...

Posted by Janine Powell on March 26

Why is high accuracy required? And why is high accuracy important? In the context of bonding directly to wafer, +/- 1.5um allows for ...

Posted by Palomar Technologies MarCom Team on March 19

[For English translation, click here.] La fiabilité d’un câblage par la technique nommée « Ball bonding » requière usuellement l’ajout ...

Posted by Palomar Technologies MarCom Team on February 12

With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the ...

Posted by Janine Powell on February 5

Wire bond interconnects have traditionally been considered "forward" bonded wires. Forward bonding refers to bonding from an integrated ...

Posted by Janine Powell on January 22

It's hard to believe we're already well into the new year. Echoing the happy new year well wishes from our CEO, the entire Palomar ...

Posted by Palomar Technologies MarCom Team on January 8

IMAPS 2012 delivered another great conference covering a wide array of topics. Held this year in San Diego, hundreds of industry peers, ...

Posted by Palomar Technologies MarCom Team on September 18

With the growing installed base of 3800 Die Bonder customers and the long-standing presence of the 8000 Wire Bonder across the APAC region, ...

Posted by Palomar Technologies MarCom Team on August 14

SEMICON West is the flagship annual event for the microelectronics industry, with 2012 bringing together 690 exhibiting companies from 21 ...

Posted by Palomar Technologies MarCom Team on July 24

To live today without the assisitance and support of microelectronic-controlled devices is borderline unthinkable—unless you are romantic ...

Posted by Palomar Technologies MarCom Team on July 17