Stack Die (3D IC) Assembly – Drivers and Challenges
With the increased demand for improved functionality and miniaturization in portable hand-held devices—such as cell phones, PDA, digital ...
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With the increased demand for improved functionality and miniaturization in portable hand-held devices—such as cell phones, PDA, digital ...
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Productronica is the world’s leading international trade fair for innovative electronics production. The 2011 show—held at a large modern ...
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Automated assembly lines aren’t a new concept. For some of us, the term conjures memories of pictures or videos shown in grade school about ...
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Well, it is that time of year again. This week is the 44th International Symposium on Microelectronics - IMAPS 2011. This year's conference ...
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Manufacturers are constantly confronted with device integration challenges as consumers want electronics to be smaller, more easily ...
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SEMICON Taiwan is the premier event for microelectronics manufacturing in Taiwan, providing a platform to connect with the companies, ...
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The objective of RF packaging—where RF (radio frequency) is the range of electromagnetic frequencies above the audio range and below ...
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Today’s multipurpose wire bonding machines are required to deliver a combination of wires, bumps and specialty interconnects. Multipurpose ...
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The SEMICON West 2011 show floor has been buzzing with confidence and optimism for the microelectronic packaging industry. “SEMICON West is ...
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The majority of light engines are currently assembled offshore, posing the threat of loosely regulated process flows and an increased risk ...
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