Well, it is that time of year again. This week is the 44th International Symposium on Microelectronics - IMAPS 2011. This year's conference ...

Posted by Palomar Technologies MarCom Team on October 12

Manufacturers are constantly confronted with device integration challenges as consumers want electronics to be smaller, more easily ...

Posted by Palomar Technologies MarCom Team on September 30

SEMICON Taiwan is the premier event for microelectronics manufacturing in Taiwan, providing a platform to connect with the companies, ...

Posted by Palomar Technologies MarCom Team on September 20

The objective of RF packaging—where RF (radio frequency) is the range of electromagnetic frequencies above the audio range and below ...

Posted by Palomar Technologies MarCom Team on September 6

Today’s multipurpose wire bonding machines are required to deliver a combination of wires, bumps and specialty interconnects. Multipurpose ...

Posted by Palomar Technologies MarCom Team on July 15

The SEMICON West 2011 show floor has been buzzing with confidence and optimism for the microelectronic packaging industry. “SEMICON West is ...

Posted by Palomar Technologies MarCom Team on July 14

The majority of light engines are currently assembled offshore, posing the threat of loosely regulated process flows and an increased risk ...

Posted by Palomar Technologies MarCom Team on June 2

Situated in the heart of Bavaria and with over half a million inhabitants, Nuremberg is one of Europe’s most beautiful cities, rich in ...

Posted by Palomar Technologies MarCom Team on May 5

High-reliability wire bonding traditionally required the addition of a security bond over the stitch—or second bond—of each ball bonded ...

Posted by Palomar Technologies MarCom Team on April 20

Semiconductor packaging industry experts are continually reworking designs to reduce application package size—however, there remain a ...

Posted by Palomar Technologies MarCom Team on March 21