[For the English version, click here.] 我们可以肯定地说，任何利用自动球焊机的单位都会不断致力于提高生产力和效率。电脑及软件的性能在维持最佳生产状况这方面是至关重要的，特别是对于复杂的混合生产。智能交互式图形界面（Intelligent ...

Posted by Janine Powell on September 17

[For the English version, click here.] Es ist unumstritten – überall wo automatische Drahtbonder eingesetzt werden, wird ständig versucht ...

Posted by Janine Powell on August 27

Today’s mainstream electronics manufacturing consists mainly of semiconductor packages and surface mount technology processes. Together, ...

Posted by Janine Powell on August 20

SEMICON West is the flagship annual event for the global microelectronics industry. It is the premier event for the display of new products ...

Posted by Janine Powell on August 13

It is safe to say that any organization utilizing an automated wire bonder continually strives to increase productivity and efficiency. ...

Posted by Janine Powell on July 30

SEMICON West 2013 is barely two weeks away; attendees are just days away from over 50 hours of technical programs and focused access to ...

Posted by Janine Powell on June 25

[For English, click here.] 为了提高第二焊接点的可靠性，传统上是在第二个焊接点上焊上一个球(security bond)。虽然这种方法确实创造一个更可靠的焊线，它同时也导致产量的下降。这方法只能使用正向的焊线动作。 ...

Posted by Palomar Technologies MarCom Team on June 4

Today’s microelectronic manufacturing environments seem to be constantly changing. One day you are building up traditional “flat-land” ...

Posted by Janine Powell on April 9

SEMICON China celebrated its 25th year, held this year at the Shanghai New International Expo Center on March 19-21. Mr. PH Chan, Palomar ...

Posted by Janine Powell on March 26

Why is high accuracy required? And why is high accuracy important? In the context of bonding directly to wafer, +/- 1.5um allows for ...

Posted by Palomar Technologies MarCom Team on March 19