PTI Blog

Ball Bonding vs. Wedge Bonding

For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated ...

Posted by Janine Powell on

LED Market Outlook is Bright

Last week was the 15th anniversary of the Strategies in Light technical conference. Over 5,000 people attended the conference, and more ...

Posted by Janine Powell on

Integrating i2Gi™ onto an 8000 Wire Bonder (i2Gi™软件与球焊机8000的结合)

[For the English version, click here.] 我们可以肯定地说,任何利用自动球焊机的单位都会不断致力于提高生产力和效率。电脑及软件的性能在维持最佳生产状况这方面是至关重要的,特别是对于复杂的混合生产。智能交互式图形界面(Intelligent ...

Posted by Janine Powell on

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