Ball Bonding vs. Wedge Bonding
For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated ...
Posted by Janine Powell on
For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated ...
Posted by Janine Powell on
Wire bond interconnects have traditionally been considered "forward" bonded wires. Forward bonding refers to bonding from an integrated ...
Posted by Janine Powell on
Last week was the 15th anniversary of the Strategies in Light technical conference. Over 5,000 people attended the conference, and more ...
Posted by Janine Powell on
Often when companies are discussing potential projects, they are at a crossroads on the most economical way to proceed with a small ...
Posted by Janine Powell on
Though the trend is moving away from gold wire for high-volume production wire bonding, gold ball wire bonding still makes up about 50 ...
Posted by Janine Powell on
[For the English version, click here.] Традиционно, ультразвуковая микросварка предполагает разварку перемычек с кристалла на подложку. ...
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[For the English version, click here.] productronica 2013 feiert sein 20 jähriges Jubiläum als die „internationale Leitmesse“ für ...
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Hughes Aircraft is one of America’s great iconic companies and arguably the pioneer of the avionics, aerospace and defense industry we know ...
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[For the English version, click here.] 我们可以肯定地说,任何利用自动球焊机的单位都会不断致力于提高生产力和效率。电脑及软件的性能在维持最佳生产状况这方面是至关重要的,特别是对于复杂的混合生产。智能交互式图形界面(Intelligent ...
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[For the English version, click here.] Es ist unumstritten – überall wo automatische Drahtbonder eingesetzt werden, wird ständig versucht ...
Posted by Janine Powell on
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