Live Demos of Large Work Area Wire Bonder & Universal Bond Tester (Productronica 2011)

Productronica is the world’s leading international trade fair for innovative electronics production. The 2011 show—held at a large modern trade-fair ground in Munich, Germany on November 15-8—was one of the few opportunities in the world where you will find the entire value chain for electronics manufacturing under a single roof. For visitors and exhibitors alike, this means a complete overview of the market.Productronica 2011 Royce Wire Tester and Large Area Wire Bonder

This year, the Palomar Technologies Europe team—based in Erlangen, Germany—exhibited our extremely versatile wire and ball bonder (the 8000 Wire Bonder) as well as a Royce Instruments universal pull-/ shear tester.

The high-speed 8000 Wire Bonder provides high accuracy, precision and customization. The Palomar Technologies booth offered live demonstrations on the show floor to showcase some of the system’s capabilities, such as deep access of 11.10 to 19.05mm and tall multi-level bonding (˃12.7mm). The wire bonder was equipped with extremely large work stage of 12x12inch to demonstrate its extremely large bonding area of 304x152mm. The system has a cycle time of 0.125/wire and 0.077 sec/bump.

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Both the 8000 Wire Bonder and the Royce Pull-/ Shear Tester 650 gained great attention and praise from the Productronica show participants, stirring up some excellent discussions on specific applications and assembly requirements.

Productronica 2011 Large Area Wire BonderAttendees were delighted to learn more about the contract assembly solutions offered by Palomar Technologies Assembly ServicesTM (“Assembly Services”). This division provides the advantage of Palomar Technologies' expertise of precision microelectronic packaging solutions without the immediate need to invest in capital equipment. With the ability to provide test, prototyping or mid-volume production, Assembly Services upholds high-accuracy precision die bonding and wire bonding for an array of applications including large complex hybrids device packaging.

Clean rooms for contract assembly services packaing for optoelectronicsAn added value is that once the Assembly Services customer’s product is ready for high-volume production, the Palomar Technologies team of experts can transfer the production-ready processes and required equipment to the customer’s internal manufacturing location. It is solution for all who wish to release new, qualified products to market quickly and without the delay of capital expenditure.

Productronica 2011 consisted of four energy-packed days, filled with thousands of visitors and many events. As opposed to previous years, many attendees came to Productronica 2011 with approved projects and, therefore, were actively looking for a solution. This is good and bad—we all know that once the green light is given (purchase is approved), customers tend to ask for delivery “yesterday!” But that’s how our industry works!

In summary, despite the ongoing US$ and € crises, there is a clear sign that companies will continue to significantly invest in microelectronic packaging solutions in the coming year. Productronica 2011 was one the best exhibitions in many years! Palomar Technologies is already looking forward to Productronica 2013!

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Josef Schmidl
Managing Director, Palomar Europe
Palomar Technologies