Clean room space is expensive. Obtaining the highest component placement accuracies and the versatility of high-precision application processes on a small footprint die bonder certainly offers “more bang for its buck.” Small footprint die bonders—such as the high-precision 6500 Die Bonder—are a competent choice for R&D and prototyping scenarios when accuracy requirements still remain “unknown”, which is inherent to product development in the our line of work.
Once an application process has been finalized, the ability to seamlessly transfer a process from small-scale to full-size production on the same small footprint machine not only reduces the delay of bringing product to market, but also eliminates any additional training, as the staff is already knowledgeable. Equipment allowing for proactive machine monitoring and correlated process performance is a key step in controlling quality, production uptime and thus cost. Predictive Preventative Maintenance (PPM) is crucial to mitigate risk in all of these areas.
When searching for a small footprint die bonder, choosing a system backed by decades of R&D, prototyping and production expertise combined with reliable support and customer services will only increase the longevity of your investment.
Small Footprint Die Bonder For Ultra-High Accuracy
The 6500 Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary 1.5µm micron-level placement accuracy (application-dependent) for photonic, wireless and medical applications. Currently deployed 6500 Die Bonder systems are exceeding their “work horse” expectations with production bouts exceeding 20 hrs/day, six days a week for die attach in optoelectronic and printhead assemblies.
Wafer Scale Packaging (WSP)
A specialized configuration of the 6500 Die Bonder for wafer scale packaging eutectic die attach provides customers with a complete microelectronic solution for laser diode attachment (die-to-wafer), pulsed heat pick tool for 80/20 Au/Sn pulsed reflow attachment, wafer stage with steady state heating, and waffle or gel pack presentation of laser diode applications.
6500 Die Bonder WSP Features
- Integrated lookup camera with laser stripe and laser edge alignment algorithm
- Ultra-high accuracy eutectic cycle times less than 35 seconds, including the in-situ heat and cool cycle for each laser diode
- Single pulsed heat tool optimized for specific die size and desired heat profile for processes such as P-side down laser attach
- Pulsed heat profile controller with programmable profiles and performance tracking
An advanced Cognex pattern recognition system enables the 6500 Die Bonder lookdown camera to locate the wafer substrate locations and laser using multiple search and alignment algorithms, including area and edge alignment. The lookup camera identifies any needed corrections in the pick process. This system includes auto focusing with programmable on- and off-axis lighting systems to maximize contrast and accuracy in component placement.
Operating in a true Microsoft Windows XP Pro environment, the wafer scale packaging eutectic capabilities on the 6500 Die Bonder bring unparalleled software flexibility, power and ease-of-use to precision hybrid component assembly. The user-friendly interface assists in setup, operation, diagnostics and calibration.
Watch the Video
----
Jim O'Bryan
Chief Engineer
Palomar Technologies