Through decades of experience with automatic, highly versatile and precise die attach systems, I have learned a few important lessons in the process. In comparing automatic die bonders currently on the market, a prudent engineer should look deeper than simply machine specs. For example, I came across an established manufacturer of manual die bonders that has just entered the market with their first automatic machine. The specifications were impressive and the price was significantly lower than other automatic die bonders. It sounded too good to be true! And it was. Further research revealed that this machine isn’t fully developed and therefore the product launch seemed premature—the system is not a comparable solution to the established automated systems currently available.
Some organizations may feel successful with manually operated die attach systems and may, therefore, fall into the mental rut of “if it’s not broken, why fix it?” But for those who strive for high-accuracy, precision and immensely greater throughput, automated die bonders are, essentially, production gold mines. The next hurdle is which automated system to choose:
1) a machine from a company just tapping into the automated assembly system market
or
2) an organization that has pioneered and perfected the accuracy, repeatability and reliability of component packaging for decades?
The latter is a safe bet for not only a reliable system, but for experienced process knowledge and readily available customer services and support.
In further assessment of the newly emerging manual-turned-automatic die bonders, here are some key features of high concern:
- Single programming level. It is very difficult to program devices at any complexity and modify them later. It is extremely misleading to tell a customer that it is very easy and quick to program a foolproof product development in one go. A savvy customer should recognize this may work in a lab environment to build a few prototypes, however, would be unwieldy for even small-scale production with a high-product mix. A better choice would be to go with a company that openly discusses software scalability and offers the support to make program updates as your production needs change.
- Single pick-up tool requiring a manual change. Although I hear plans of a docking station with up to only five pick-up tools for automatic tool change, this is not currently available on the recently released automatic die bonders—a customer acting as a company’s guinea pig while they work out the “bugs” in the design is sure to be displeasing. Increased throughput is achievable and useful on a high-accuracy and proven automated system. Throughput is further enhanced on a fully automated, bi-direction 6- or even 8-position tool turret for maximum flexibility during production.
- Self-designed machine vision system or use an inexpensive version from a third party. A low-cost die attach system is a red flag for cutting corners. Rather than using a highly capable and trusted system such as Cognex, a simple demonstration of a cheaply engineered vision system doesn’t even approach the flexibility and competency of Cognex, which is currently utilized on leading automatic die bonders available today. Cognex is the gold standard.
- Self-developed machine software. Home-grown software that is not based on any standard user interface such as Windows™, in my experience, can be very risky to upgrade and is certainly not something on which to base your production. Having a die attach system backed by Windows™ software ensures reliability in data capturing and navigating.
- Lack of service and support. Designing, building and servicing automated microelectronic assembly equipment worldwide requires a more diligent support infrastructure. A team of experts who specialize in automatic die attach with decades of experience in required. Manual equipment is less complex—a team who has historically managed only manual bonders would struggle to support a new automated machine. The lack of expertise also implies an inability to provide experience-based support and field services. Proper training, maintenance and overall system support on automated die bonders not only maintains high precision and high throughput of application packaging, but also the safety of technicians and longevity of your capital equipment investments.
In the end the common saying holds true: “You get what you pay for.” One can drive a Fiat Punto or a Mercedes—both have an engine, four wheels and drive you from Munich to Berlin. But, for the long-term investment and proven track record of excellence, support and high-reliability, the latter is the clear choice.
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Josef Schmidl
Managing Director, Palomar Europe
Palomar Technologies