Flip Chip & MEMS Assembly with High-Mix, Automatic Die Sorters

As microelectronics device designs evolve, so must handling and assembly processes. A common example is with the process of removing product from tape after wafer processing and dicing is complete. While traditionally product was removed by hand through the use of a needle and vacuum wand or tweezers, today’s smaller, fragile and complex devices require a more precise process.

Die Sorting At a Glance
A die sorting system is designed to remove die from tape using an ejector mechanism and place them to output carriers, such as Gel-Pak, waffle pack, JEDEC tray, film frame or grip ring. Whether semi-automatic or fully-automatic, a die sorter offers a number of advantages over a manual die handling process. Semi- and fully-automatic die sorters provide the user complete control over the exact die eject parameters, such as eject needle height, eject speed and placement pattern on the output through the use of process recipes. This allows repeatable processing from one die to the next of the same product, as well as different settings to be used for different products. With every die picked in the same manner, process yield and throughput are increased while damage to devices from manual handling is eliminated. In addition, ergonomics for the operator is greatly enhanced.

Semi-Automatic? Fully Automatic? Which to Choose
When evaluating a die sorter solution, it is important to consider Royce DE35-ST output station configured with underside inspection and die inverterwhether a semi-automatic or fully-automatic system is required. A semi-automatic die sorter offers a repeatable process at a lower cost than a fully-automatic system and is ideal for applications with a wide variety of different products. A semi-automatic solution can also be outfitted with underside and edge inspection options so that the operator can ensure the die placed to the output reflect quality product. One such system is the Royce Instruments DE35-ST Semi-Automatic Die Sorter. With this system the operator uses hand wheels to align the die with the onscreen targets before stepping on a foot pedal to initiate one die pick cycle. This process offers a throughput ranging from 500 to 1200 units per hour, depending on the application.

For processes that require a higher throughput or greater die traceability, a fully-automatic solution is recommended. Royce MP300 wafer map for multi-project wafersFully-automatic die sorters have a motorized input stage controlled by a vision system that targets and precisely centers the die over the eject head prior to picking the die. This allows an entire wafer to be processed without operator input. These systems can also run from wafer map: an electronic file typically output from a prober system. The map tells the system which die to pick and which output tray to sort to. With the Royce Instruments fully-automatic AutoPlacer MP300, picking of die from multi-project wafers (“Pizza wafer”) with varying die sizes is possible, with a throughput of approximately 2000 units per hour (application dependent). Ink dot recognition is also supported.

Flip Chip and MEMS Application Process Solution
Both the Royce DE35-ST and MP300 die sorters offer quick-change tooling to support high-mix, medium-volume applications and are configurable to meet a wide variety of process requirements. For flip chip applications as an example, Royce offers a die inverter to flip the die prior to placing it to the output tray. In addition, Royce non-surface contact edge gripper mechanismto meet the demand of MEMS (micro-electro-mechanical systems) and optical devices where the device surface cannot be touched, Royce offers its unique non-surface contact solution. In this case, rather than using a surface contact pick-up tip, two or three Vespel gripper fingers are used to grip the die along its edge rather than its surface.

Royce Instruments invites you to visit booth #308 at the 2012 IMAPS exhibition in San Diego to discuss your die sorting process and see a live demonstration of the Semi-Automatic DE35-ST Die Sorter. For those interested in bond testing, Royce’s latest bond tester, the Royce 620 Multitest Bond Tester from the Royce 600 Series Bond Test Instruments, will also be on display.

Can’t Make It to the Show?
For more information on the Royce Instruments, Inc. product line of US-designed and manufactured bond testers and die sorters, contact Sarah Kinzli, Sales Applications Engineer, at skinzli@royceinstruments.com or (707)255-9078 x142; visit Royce online at www.royceinstruments.com; or contact Palomar Technologies.

Download these resources to learn more about Royce:

Royce Instruments Data Sheets
Royce Instruments Data Sheets
Introduction to Automated & Semi-Automated Die Sorting eBook 
Royce Instruments, die sorting, flip chip
Introduction to Automated Flip Chip Assembly eBook
Royce Instruments, flip chip, die sorting
 

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Palomar Technologies would like to thank Sarah Kinzli and the Royce Instruments team for their valuable overview of die sorting solutions. The Royce MP-300 and DE35-ST die sorters will enhance your automated die attach processes on a 3800 Die Bonder, 6500 Die Bonder or a factory-refurbished 3500-III-R Die Bonder.