IMAPS 2012 delivered another great conference covering a wide array of topics. Held this year in San Diego, hundreds of industry peers, leaders and exhibitors from around the globe attended the sessions and exhibition hall. IMAPS 2012 featured six technical tracks that spanned the three days of sessions, including: 3D IC/Packaging; Modeling, Design & Reliability; Next Generation Materials; Advanced Technologies; Assembly and Packaging; and the international track entitled Packaging & System Integration: A Global Perspective.
There was also an Interactive University Poster Session highlighting new research and developing methods from universities around the world. The 2012 symposium was loaded with new/enhanced features, including a revamped Thursday program that featured two keynotes on 3D packaging, a 3D panel discussion and exhibitor "power hour" presentations each day in the hall. In addition, Palomar Technologies hosted four Poway High School engineering and robotics students in booth #322 to instill excitment for the microelectronics design and packaging industry. IMAPS 2012 was a constant buzz of discussion, learning and networking.
Palomar Technologies presented three papers at this international technical conference:
- High-Reliability Component Attachment Process for <5um Placement Accuracy—Mr. Donald Beck, Assembly Services general manager
- Mixed Attachment Technology Studies in RF & Optoelectronic Packages Requiring High Accuracy Placement—Mr. Daniel Evans, senior scientist
- Gold Ball Wire Bonding with Heated Tool for Automotive Microelectronics—Mr. David Rasmussen, senior applications engineer
If you were not able to join the Palomar Technologies presentations, we are offering two complementary on-demand webcasts:
- High-Reliability Component Attachment Process for <5um Placement Accuracy (download to view on IMAPS.org)
- Automated Precision Assembly for High-Volume HB LEDs (instant viewing on YouTube)
Daniel Evans was awarded the prestigious 2012 John A. Wagnon Technical Achievement Award for his many contributions to this industry. The John A. Wagnon Technical Achievement Award is given to an IMAPS member who, in the opinion of the John A. Wagnon Technical Achievement Award Selection Committee, has made outstanding technical contributions related to microelectronics technology. The award may be given for a specific accomplishment, for a number of accomplishments over a period of years, or for general overall contributions to the microelectronics industry.
There seems to be a continuing theme in the packaging tracks: more and more companies and programs are in need of ultra-high accuracy die attach with special focus for automated component placement below 5-micron, 3 sigma to even the 1.5-micron, 3 sigma, range. Wafer scale AuSn attachments, P-Side down edge emitting Laser Diode Attach —lens, collimators, rotators—and attachment in Optoelectronic packaging are all requiring increasingly higher placement accuracies today.
Automated gold wire bonding also continues to evolve, and were discussed in detail at the 2012 IMAPS conference. Very high reliability interconnect methods have a growing market space as packages like automotive sensors, implantable medical, RF and power amplifier markets evolve. Today, it has been proven that stand-off-stitch wire bonding offers the most reliable first-level interconnect methodology. New exotic materials, like platinum, finding traction as well especially in the biomedical markets.
One facet of the packaging industry that was not very apparent at IMAPS 2012 was precision microelectronics contract assembly. There are not many businesses that can address precision production builds in addition to advanced process development, rapid prototyping, and small-to-medium volume contract manufacturing.
A number of attendees stopped by the Palomar Technologies booth to learn about Assembly Services. Some just need 30-50 prototype units to go after new contracts; others came with unique new packaging concepts and requirements. However, all left with an understanding that Assembly Services includes the leveling of 25+ years of experience in microelectronics and optoelectronics packaging with our customers.
Again, another great year for IMAPS, and for the many presenters and exhibitors that attended this year’s international conference.
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Bradley Benton
Regional Account Manager, Western Americas
Palomar Technologies, Inc.