[For a version of this blog in English, click here.] 最近Palomar Technologies收购了 SST 国际作为合作伙伴,为我们的客户提供整体的生产解决方案。两家公司在很多领域都有不同的功能. ...

Posted by Katie Finney on December 1

The International Wafer-Level Packaging Conference (IWLPC) was held in San Jose, California in October. Over 650 industry experts were in ...

Posted by Katie Finney on November 24

For a version of this blog in English, click here. Si l’assemblage automatique d’équipements est l’activité principale de votre entreprise, ...

Posted by Katie Finney on November 17

Recently, Palomar Technologies acquired SST International as a partner in providing our customers with total solutions. There are many ...

Posted by Janine Powell on November 3

Glass to metal sealing technology has been around for decades and is still an important technology for many microelectronics products. ...

Posted by Julia Picarelli on October 23

Last month, we announced the latest addition to the Palomar suite of die attach and wire bonding solutions. This new machine is called the ...

Posted by Katie Finney on October 20

Before we were Palomar Technologies, we were a subdivision of Hughes Aircraft in the 1970s within the assembly and test products product ...

Posted by Katie Finney on October 13

As new product development becomes a large part of the microelectronics landscape, and your customer’s requirements become more ...

Posted by Julia Picarelli on October 8

Although Palomar Technologies belongs to a niche industry, there are multiple markets in which we serve. Some of those markets include ...

Posted by Katie Finney on October 6

For a version of this blog in English, click here. 第一台键合机是于 1957 年设计的，它是一台热压缩楔键合机。超声波键合是在 1960 年代初引入。热超声键合于 1970 年首次亮相。 到了80 ...

Posted by Katie Finney on September 29