Well, it is that time of year again. This week is the 44th International Symposium on Microelectronics - IMAPS 2011. This year's conference ...

Posted by Palomar Technologies MarCom Team on October 12

Once wire bonding or die bonding is complete, the next step in the microelectronics assembly process is to test the quality of the ...

Posted by Palomar Technologies MarCom Team on October 10

Manufacturers are constantly confronted with device integration challenges as consumers want electronics to be smaller, more easily ...

Posted by Palomar Technologies MarCom Team on September 30

SEMICON Taiwan is the premier event for microelectronics manufacturing in Taiwan, providing a platform to connect with the companies, ...

Posted by Palomar Technologies MarCom Team on September 20

Wafer-Level Packaging (WLP) has become widely accepted in the microelectronics industry due to the demand for smaller form factor in ...

Posted by Palomar Technologies MarCom Team on September 15

The objective of RF packaging—where RF (radio frequency) is the range of electromagnetic frequencies above the audio range and below ...

Posted by Palomar Technologies MarCom Team on September 6

Die bonding with eutectic solder processing is becoming more important as thermal challenges increase with the proliferation of laser diode ...

Posted by Palomar Technologies MarCom Team on August 23

We have all been there—your wire bonder is giving you that steady working “hum” and the product your customer needs is nearing on-time ...

Posted by Palomar Technologies MarCom Team on August 15

Consumers today are inundated with the concept of "paper-free." Magazines and newspapers are readily available on the Internet, online ...

Posted by Palomar Technologies MarCom Team on August 2

SEMICON West 2011 was a busy show. Attendance was up, and the flow of people through the packaging exhibit area was steady throughout the ...

Posted by Palomar Technologies MarCom Team on July 19