[For the English version, click here.] “如果您正在生产高价值的密封元件，在封装密封环中产生高空隙的后果是什么？” 封装密封圈中高度的空隙可能会导致泄漏故障，从而降低元件的可靠性和性能。 ...

Posted by Janine Powell on August 22

When it comes to microelectronics assembly, there are many challenges and solutions. One of the most critical differences between a manual ...

Posted by Janine Powell on August 1

[For the English version of this blog, click here.] Les interconnexions en câblage filaire dans l’électronique on traditionnellement été ...

Posted by Janine Powell on July 18

Last year, I wrote a blog about general EFO theory. This edition will focus on the history of the “flame-off” and a few more advanced ...

Posted by Janine Powell on July 5

[View the blog in English here.] 今天, 绝大部分的高生产焊接电子元器件应用都 使用带式焊炉。带式焊炉的典型长度超过20英尺。这些高批量生产流程需要 <200 ppm 氧气水平, 氮气冲洗 (以达到如此低的 ppm 氧气水平) 和恒定的 ...

Posted by Janine Powell on May 30

Microelectronic Mechanical Systems, or MEMS, technology is everywhere we look. The biotech, medical device, communications, and inertial ...

Posted by Janine Powell on May 23

Sometimes we get requests from customers or potential customers needing a bonder right away. Of course, we try to do everything we can to ...

Posted by Janine Powell on May 9

In many bonding applications, whether for die attach or wire bond, a successful bond can depend greatly on the method by which the parts ...

Posted by Janine Powell on May 2

Palomar Technologies modern bonding systems have a multi-decade history, with system software that has been continuously improved upon in ...

Posted by Janine Powell on April 25

Did you know that Palomar Technologies has thousands of systems installed worldwide and serviced directly by Palomar? Take a look into our ...

Posted by Janine Powell on April 18