可靠性超高的键合方案 (Ultra High-Reliability Wire Bonding)
[For English, click here.] 为了提高第二焊接点的可靠性,传统上是在第二个焊接点上焊上一个球(security bond)。虽然这种方法确实创造一个更可靠的焊线,它同时也导致产量的下降。这方法只能使用正向的焊线动作。 ...
Posted by Palomar Technologies MarCom Team on
[For English, click here.] 为了提高第二焊接点的可靠性,传统上是在第二个焊接点上焊上一个球(security bond)。虽然这种方法确实创造一个更可靠的焊线,它同时也导致产量的下降。这方法只能使用正向的焊线动作。 ...
Posted by Palomar Technologies MarCom Team on
Today’s microelectronic manufacturing environments seem to be constantly changing. One day you are building up traditional “flat-land” ...
Posted by Janine Powell on
SEMICON China celebrated its 25th year, held this year at the Shanghai New International Expo Center on March 19-21. Mr. PH Chan, Palomar ...
Posted by Janine Powell on
[For English translation, click here.] La fiabilité d’un câblage par la technique nommée « Ball bonding » requière usuellement l’ajout ...
Posted by Palomar Technologies MarCom Team on
It's hard to believe we're already well into the new year. Echoing the happy new year well wishes from our CEO, the entire Palomar ...
Posted by Palomar Technologies MarCom Team on
To live today without the assisitance and support of microelectronic-controlled devices is borderline unthinkable—unless you are romantic ...
Posted by Palomar Technologies MarCom Team on
SMT Hybrid Packaging is Europe's leading event on system integration in microelectronics. From 8–10 May, 2012, over 565 exhibitors ...
Posted by Palomar Technologies MarCom Team on
Mobile electronic products continually require finer geometries for packaged integrated circuits. Wireless phones, PDA and digital cameras ...
Posted by Palomar Technologies MarCom Team on
New products, new materials and new approaches in the high-frequency electromagnetic spectrum seemed to be the common theme at the Feb 7-9 ...
Posted by Palomar Technologies MarCom Team on
Productronica is the world’s leading international trade fair for innovative electronics production. The 2011 show—held at a large modern ...
Posted by Palomar Technologies MarCom Team on
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