Measuring Wire Bonding Ultrasonic Performance

We have all been there—your wire bonder is giving you that steady working “hum” and the product your customer needs is nearing on-time ...

Posted by Palomar Technologies MarCom Team on August 15

Ultra High-Reliability Wire Bonding

High-reliability wire bonding traditionally required the addition of a security bond over the stitch—or second bond—of each ball bonded ...

Posted by Palomar Technologies MarCom Team on April 20

Flux-Less Micro BGA Solder Reflow

Palomar Technologies Assembly Services (“Assembly Services”) offers unique assembly methods supporting flux-less Micro Ball Grid Array ...

Posted by Palomar Technologies MarCom Team on April 13

Semiconductor and Odd-Form Factor Package Wire Bond Case Studies

Semiconductor packaging industry experts are continually reworking designs to reduce application package size—however, there remain a ...

Posted by Palomar Technologies MarCom Team on March 21

Gold Ball Bonding for LEDs and High-Power Applications

One frequently asked question when addressing high-power wire bonding applications is “how many wires do I need?” As a common ...

Posted by Palomar Technologies MarCom Team on February 17

Stand-Off Stitch Auxiliary Wires for Improved Wire Bond Reliability

Whether it is for a critical biomedical device, the latest spacecraft or military weapon system or just your new big screen TV at home, the ...

Posted by Palomar Technologies MarCom Team on January 20

Semicon West 2010 - Preview

July 13th - The DAY We are now only days away from Semicon West 2010, which opens at 10 AM on Tuesday, July 13th at the Moscone Center in ...

Posted by Palomar Technologies MarCom Team on July 8

Solder Bump Bonding, Ball Bumps and Wire Bonds

Continuing on with our overview of microelectronic interconnection methods, we will discuss three additional methods: Solder Bump Bonding, ...

Posted by Palomar Technologies MarCom Team on May 24

Automation & Expertise in Contract Assembly

Taking from our last post, we determined that the playing field of contract assembly in complex microelectronics, in regards to cost has ...

Posted by Palomar Technologies MarCom Team on January 22