SMT Hybrid Packaging is Europe's leading event on system integration in microelectronics.
From 8–10 May, 2012, over 565 exhibitors presented their latest developments and products in the industry to more than 22,000 visitors...all within a 27,700m² networking space!
This year, the Palomar Technologies Europe team (based in Erlangen, Germany) exhibited its high-reliability ball bumper and wire bonder—the 8000 Wire Bonder—as well as the universal pull-/ shear tester of its alliance Royce Instruments (based in Napa, CA, USA).
The high-speed 8000 Wire Bonder/Ball (Stud) Bumper—which provides high accuracy, precision and customization—performed live demonstrations on the exhibit floor. This fully automatic system provides deep access of 11.10 to 19.05mm and tall multi-level bonding (˃12.7mm). The bonder was equipped with extremely large 12" x 12” work stage to demonstrate its actual large bonding area of 304 x 152mm. The system has a cycle time of 0.125/wire and 0.077 sec/bump.
Watch the 8000 Wire Bonder Overview Video
Both the 8000 Wire Bonder and Royce Pull-/ Sear Tester 650 gained great attention and praise from the SMT/ Hybrid show participants as the Palomar Technologies Europe team—consisting of Josef Schmidl (Managing Director in Europe), Dale Perry (Eastern Regional Account Manager, Eastern Americas), Norbert Schwindl (EMEA Service Engineer/ Coordinator) and Daniel Knoblach (EMEA Service Engineer)—proudly demonstrated both systems impressive versatile qualities. There were some excellent discussions on specific customer applications and assembly requirements.
Customers without the need to invest in capital equipment this year were delighted to learn more about Palomar Technologies Assembly ServicesTM ("Assembly Services"). This comprehensive contract assembly service provides customers around the globe the advantage 
of Palomar Technologies' expertise of precision microelectronic packaging solutions. It offers the ability from prototype to mid-volume production of high-accuracy die bonding and wire bonding for an array of applications, including large complex hybrids device packaging. Once the customer’s product is ready for high-volume production, a Palomar Technologies team of experts transfer the production-ready processes and equipment set to one of our qualified contract manufacturers, a customer’s internal manufacturing or a preferred supplier. It’s solution for all who wish to release new qualified products to market quickly without the delay of capital expenditure.
After three exhibition days in Nuremberg, SMT Hybrid Packaging 2012 can be considered a great success. Although the first day of the show was relatively quiet, Palomar’s show team was very busy for the remaining two days. In the end, it is the quality of conversations and valuable connections which made the show a success. Participating this show now myself for more than 25 year, I can say it was a show well worth attending.
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Josef Schmidl
Managing Director, Palomar Technologies GmbH
Palomar Technologies