LEDs Still Shining Bright After Strategies in Light?

Strategies in Light 2012 brought out the "who’s who" in Solid-State Lighting (SSL) technologies and capabilities. Palomar Technologies ...

Posted by Palomar Technologies MarCom Team on February 21

HB LEDs Advanced Packaging Solutions - IMAPS 2011

Well, it is that time of year again. This week is the 44th International Symposium on Microelectronics - IMAPS 2011. This year's conference ...

Posted by Palomar Technologies MarCom Team on October 12

AuSi and AuSn Eutectic Die Attach Case Studies

High power transistor, laser and LED devices require packaging to remove thermal energy from the die. Although some silver filled epoxies ...

Posted by Palomar Technologies MarCom Team on March 12

Improved Eutectic Die Attach with a Pulse Heat Stage…Some Like it Hot!

With the successful deployment of the Pulse Heat Stage (PHS) system from Palomar Technologies, our field sales and engineering teams often ...

Posted by Palomar Technologies MarCom Team on February 1

Automated Eutectic Die Attach for Device Thermal Management

Device thermal management has become more essential as packages run at higher frequencies and higher power levels. Designers are thinning ...

Posted by Palomar Technologies MarCom Team on January 15

IMAPS 2009 San Jose - Review

IMAPS 2009 in San Jose was, as expected, slow due to current economic conditions. It was evident that reduced travel budgets and last ...

Posted by Palomar Technologies MarCom Team on November 17

Steady State Eutectic Attach using Force/Scrub

This is Part 3 of the Eutectic Die Bonding 101 series. In the previous 2 blogs, we discussed what "eutectic" means, the variables and ...

Posted by Palomar Technologies MarCom Team on October 23

Void Free Eutectic Attach

This is Part 2 of "Eutectic Die Bonding 101". There are 10 process variables that exist, four of which Palomar is in the business of ...

Posted by Palomar Technologies MarCom Team on October 14

Eutectic Die Bonding 101

Eutectic Bonding - Why is it Necessary? This Eutectic Bond consists of three key aspects: The Electrical Contact The Primary Heat Interface ...

Posted by Palomar Technologies MarCom Team on October 6