The headwinds of inflationary trends, pandemic management, internal political tensions, rising competitiveness, supply chain issues, ...

Posted by Palomar Technologies MarCom Team on February 1

Over the years, microelectronic wire bond process and packaging engineers have debated whether to use ball or wedge bond technologies. This ...

Posted by Palomar Technologies MarCom Team on November 4

Our opening graphic contains three illustrations. Moving from left to right, these are respectively those of a stream engine, a nuclear ...

Posted by Palomar Technologies MarCom Team on October 21

One of the great shifts currently taking place in global defense sensor technologies, is due to a fundamental realignment of military ...

Posted by Palomar Technologies MarCom Team on June 1

A traditional means to justify the expense of purchasing new bonding equipment is to calculate the units per hour (UPH) of the proposed ...

Posted by Palomar Technologies MarCom Team on May 17

In Part two of our series on Packaging Technologies meet Quantum Opportunities, Palomar’s Dr. Anthony O’Sullivan interviews Dr. Andrew ...

Posted by Palomar Technologies MarCom Team on April 26

This is the first in a 3-part blog series exploring the world of quantum technologies and its impact on semiconductor packaging. With the ...

Posted by Palomar Technologies MarCom Team on March 29

As we reflect on the events of 2020 and anticipate their unfolding in 2021, our vision sharpens to reveal a clear trifecta of forces ...

Posted by Palomar Technologies MarCom Team on January 4

The COVID-19 situation is a textbook “black swan event” for the world. The unprecedented nature of this crisis makes it difficult to ...

Posted by Palomar Technologies MarCom Team on April 2

As we are all aware, COVID-19 is having a dramatic impact on our lives. Palomar Technologies is a key supplier to critical infrastructure ...

Posted by Palomar Technologies MarCom Team on March 24