Happy New Year from Palomar Technologies' CEO
As the semiconductor industry continues to develop new technologies, our weekly blog provides a lens into the viewpoints and expertise of ...
Posted by Bruce W. Hueners on
As the semiconductor industry continues to develop new technologies, our weekly blog provides a lens into the viewpoints and expertise of ...
Posted by Bruce W. Hueners on
For a version of this blog in English, click here. 第一台键合机是于 1957 年设计的,它是一台热压缩楔键合机。超声波键合是在 1960 年代初引入。热超声键合于 1970 年首次亮相。 到了80 ...
Posted by Katie Finney on
Palomar Technologies wire bonders have for many years used voice coil technology to drive the bond heads. The decision to go to voice coil ...
Posted by Katie Finney on
After a 4-day audit of its procedures, documents and processes, Palomar Technologies, leader in precision automation equipment and process ...
Posted by Katie Finney on
Palomar Technologies maintains its global presence through our Europe and Asia offices as well as attending international tradeshows. This ...
Posted by Katie Finney on
In den frühen 80igern began Palomar/Hughes mit der Entwicklung und Produktion von Wedge Bondern für die Luffahrt- und Rüstungsindustrie. ...
Posted by Katie Finney on
Thank you for visiting us at SEMICON West 2015 in San Francisco. It was a complete success! Almost 30,000 people from all over the world ...
Posted by Katie Finney on
This is the last blog of our mini-series which discusses the frequently asked questions for the 3800 Die Bonder, 8000i Wire Bonder, and the ...
Posted by Katie Finney on
This is the last blog of our mini-series which discusses the frequently asked questions for the 3800 Die Bonder, 8000i Wire Bonder, and the ...
Posted by Katie Finney on
Palomar/Hughes started designing and manufacturing wedge bonders in the early 1980s for the aerospace and defense industries. Later, these ...
Posted by Katie Finney on
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