In general, there are two main types of ultrasonic wire bonding: ball bonding and wedge bonding. Although thermosonic gold ball bonding is ...

Posted by Janine Powell on April 13

March was a busy month for Palomar Technologies with exhibiting at both the iMAPS Device Packaging and OFC 2016 technical conferences. The ...

Posted by Katie Finney on April 5

Computer and software performance is vital to maintaining peak production performance, especially for complex hybrid manufacturing. ...

Posted by Katie Finney on February 2

As the semiconductor industry continues to develop new technologies, our weekly blog provides a lens into the viewpoints and expertise of ...

Posted by Bruce W. Hueners on December 29

For a version of this blog in English, click here. 第一台键合机是于 1957 年设计的，它是一台热压缩楔键合机。超声波键合是在 1960 年代初引入。热超声键合于 1970 年首次亮相。 到了80 ...

Posted by Katie Finney on September 29

Palomar Technologies wire bonders have for many years used voice coil technology to drive the bond heads. The decision to go to voice coil ...

Posted by Katie Finney on September 15

After a 4-day audit of its procedures, documents and processes, Palomar Technologies, leader in precision automation equipment and process ...

Posted by Katie Finney on September 8

Palomar Technologies maintains its global presence through our Europe and Asia offices as well as attending international tradeshows. This ...

Posted by Katie Finney on September 1

In den frühen 80igern began Palomar/Hughes mit der Entwicklung und Produktion von Wedge Bondern für die Luffahrt- und Rüstungsindustrie. ...

Posted by Katie Finney on August 25

Thank you for visiting us at SEMICON West 2015 in San Francisco. It was a complete success! Almost 30,000 people from all over the world ...

Posted by Katie Finney on July 28